THE BITPACK
Skills
3D to 2D Patterning, Softgoods Construction
Year
2024
This low-profile daypack marks my entry into bag design, combining 3D surface modeling in Rhino with 2D patterning. Built to eliminate bag sag, the pack features an integrated cinch-compression system that allows users to instantly adapt the bag's volume to its contents.
Inspiration
Designed specifically for modern students carrying tech essentials, The Bitpack derives its name from the smallest unit of digital data (the bit). This name reflects the bag's ultra-compact footprint: a minimal, low profile pack engineered to carry essential devices without any added bulk.
Construction Workflow
Bridging digital CAD and physical fabrication, the bag was first modeled in 3D using Rhino, allowing for rapid iteration of 3D forms before unrolling the geometry into 2D patterns. Cutting the pattern via laser ensured accurate dimensions and alignment during assembly.
High Fidelity Prototype
Built using 400D Nylon Diamond Robic, the geometric diamond weave visually aligns with the bag's tech aesthetic while ensuring durability for everyday carry.
